Reducing Defective Indexes in the Printing Process of the Computer Plates with the Application of the Welding Paste

Abstract

The process of automatic assembly of the smaller components in the plate making industries represents an important manufacturing activity that influences all stages of production. Thus, it is necessary that from the beginning of this process there is a technical follow-up regarding the development of the assembly of the computer boards. The most important process in the manufacture of these plates is the welding process, where 70% of the defects occur, are found from the application of weld. In order to minimize the defects that occurred in the process phase called SMT (Surface Mount Technology) a study was made on the most frequent defects within this process with the use of 5W2H tools and the Ishikawa Diagram. Thus, the project aims to reduce defect rates in order to extend product life and continuous improvement in the automatic assembly process of smaller components.